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2 Mbit 256Kb x 8 UV EPROM and OTP EPROM Integrated Circuit Chip M27C2001-10F1

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2 Mbit 256Kb x 8 UV EPROM and OTP EPROM Integrated Circuit Chip M27C2001-10F1

Brand Name : STMICROELECTRONICS

Model Number : M27C2001-10F1

Certification : Original Factory Pack

Place of Origin : Original

MOQ : 20pcs

Price : Negotiation

Payment Terms : T/T, Western Union,PayPal

Supply Ability : 5200PCS

Delivery Time : 1 Day

Packaging Details : please contact me for details

Ambient Operating Temperature (3) : –40 to 125 °C

Temperature Under Bias : –50 to 125 °C

Storage Temperature : –65 to 150 °C

Input or Output Voltage (except A9) : –2 to 7 V

Supply Voltage : –2 to 7 V

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2 Mbit (256Kb x 8) UV EPROM and OTP EPROM

2 Mbit 256Kb x 8 UV EPROM and OTP EPROM Integrated Circuit Chip M27C2001-10F1■ 5V ± 10% SUPPLY VOLTAGE in READ OPERATION

■ ACCESS TIME: 55ns

■ LOW POWER CONSUMPTION:

– Active Current 30mA at 5MHz

– Standby Current 100µA

■ PROGRAMMING VOLTAGE: 12.75V ± 0.25V

■ PROGRAMMING TIME: 100µs/word

■ ELECTRONIC SIGNATURE

– Manufacturer Code: 20h

– Device Code: 61h

 

DESCRIPTION

The M27C2001 is a high speed 2 Mbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for microprocessor systems requiring large programs and is organised as 262,144 by 8 bits. The FDIP32W (window ceramic frit-seal package) and LCCC32W (leadless chip carrier package) have a transparent lids which allow the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For applications where the content is programmed only one time and erasure is not required,

the M27C2001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.

 

Symbol  Parameter  Value  Unit
T Ambient Operating Temperature (3)  –40 to 125 °C
TBIAS  Temperature Under Bias -50 to 125 °C
TSTG  Storage Temperature –65 to 150  °C
VCC  Supply Voltage –2 to 7  V

 


Product Tags:

small scale integrated circuits

      

integrated components

      
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