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NCP3170BDR2G Electronic IC Chips Synchronous PWM Switching Converter

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NCP3170BDR2G Electronic IC Chips Synchronous PWM Switching Converter

Brand Name : Anterwell

Model Number : NCP3170BDR2G

Certification : new & original

Place of Origin : original factory

MOQ : 10pcs

Price : Negotiate

Payment Terms : T/T, Western Union, Paypal

Supply Ability : 9500pcs

Delivery Time : 1 day

Packaging Details : Please contact me for details

Main Supply Voltage Input : −0.3 to 20 V

Voltage between PGND and AGND : −0.3 to 0.3 V

PWM Feedback Voltage : −0.3 to 6 V

Error Amplifier Voltage : −0.3 to 6 V

Operating Ambient Temperature : −40 to +85 °C

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NCP3170

Synchronous PWM Switching Converter

 

The NCP3170 is a flexible synchronous PWM Switching Buck Regulator. The NCP3170 operates from 4.5 V to 18 V, sourcing up to 3 A and is capable of producing output voltages as low as 0.8 V. The NCP3170 also incorporates current mode control. To reduce the number of external components, a number of features are internally set including soft start, power good detection, and switching frequency. The NCP3170 is currently available in an SOIC−8 package.

 

Features

• 4.5 V to 18 V Operating Input Voltage Range

• 90 m High-Side, 25 m Low-Side Switch

• FMEA Fault Tolerant During Pin Short Test

• 3 A Continuous Output Current

• Fixed 500 kHz and 1 MHz PWM Operation

• Cycle-by-Cycle Current Monitoring

• 1.5% Initial Output Accuracy

• Internal 4.6 ms Soft-Start

• Short-Circuit Protection

• Turn on Into Pre-bias

• Power Good Indication

• Light Load Efficiency

• Thermal Shutdown

• These are Pb-Free Devices

 

Typical Applications

• Set Top Boxes

• DVD/Blu−ray Drives and HDD

• LCD Monitors and TVs

• Cable Modems

• PCIe Graphics Cards

• Telecom/Networking/Datacom Equipment

• Point of Load DC/DC Converters

 

NCP3170BDR2G Electronic IC Chips Synchronous PWM Switching Converter

 

NCP3170BDR2G Electronic IC Chips Synchronous PWM Switching Converter        NCP3170BDR2G Electronic IC Chips Synchronous PWM Switching Converter

 

ABSOLUTE MAXIMUM RATINGS (measured vs. GND pin 3, unless otherwise noted)

Rating Symbol VMin VMax Unit
Main Supply Voltage Input VIN −0.3 20 V
Voltage between PGND and AGND VPAG −0.3 0.3 V
PWM Feedback Voltage FB −0.3 6 V
Error Amplifier Voltage COMP −0.3 6 V
Enable Voltage EN −0.3 VIN + 0.3 V V
PG Voltage PG −0.3 VIN + 0.3 V V
VSW to AGND or PGND VSW −0.7 VIN + 0.3 V V
VSW to AGND or PGND for 35ns VSWST −5 VIN + 10 V V
Junction Temperature (Note 1) TJ +150 °C
Operating Ambient Temperature Range TA −40 to +85 °C
Storage Temperature Range Tstg − 55 to +150 °C

Thermal Characteristics (Note 2)

  SOIC−8 Plastic Package

     Maximum Power Dissipation @ TA = 25°C

     Thermal Resistance Junction-to-Air

     Thermal Resistance Junction-to-Case

 

 

PD

RθJA

RθJC

 

 

1.15

87

37.8

 

 

W

°C/W

°C/W

Lead Temperature Soldering (10 sec):

Reflow (SMD Styles Only) Pb-Free (Note 3)

RF 260 peak °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

1. The maximum package power dissipation limit must not be exceeded.

    PD= [TJ(max) - TA] / RθJA

2. The value of JA is measured with the device mounted on 2in x 2in FR−4 board with 2oz. copper, in a still air environment with TA = 25°C. The value in any given application depends on the user’s specific board design.

3. 60−180 seconds minimum above 237°C. 

 

 

 

 

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